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Wire Bond Tools and Accessories  

The Bonding Source wire bond tool selection is focused on serving low to mid-volume assembly organizations, and any organization that needs a tool shipped immediately. All of our tools are in stock and ready to ship. The tools cover a good portion of bonding applications for microelectronics and RF/Microwave assembly. If you require a specific tool not available on our website, we suggest you call Gaiser/Coorstek directly. We have chosen Gaiser/Coorstek as our supplier of choice because of the breadth of their product line, quality, consistency and customer service.

Click on the Bonding Source P/N in Blue Below for Data Sheet Information

DescriptionBonding Source P/N Application
.001” gold ball bond capillary1572-15-625GM20DGeneral purpose ball bond tool for .001” gold wire. .625” tool length will allow for access into most microwave housings.
.0008” gold ball bond capillary1572-13S-625GM20DGeneral purpose ball bond tool for .0008” gold wire. .625” tool length will allow for access into most microwave housings.
Bottleneck Ball bond capillary 1851-13-625GM-38(1.75-11D-5)
20DAB101X10-CDR2B
.0008-.001” ball bond capillarydesigned for hard to reach areas and tight pad pitch
.001” wedge tool4445-2025-L-F-VGeneral purpose wedge tool for .001” gold and aluminum wire. Works well on Westbond machines.
.0007” wedge tool4445-1515-L-F-VGeneral purpose wedge tool for .0007” gold wire. Works well on Westbonds.
.001” deep access wedge tool 4560-1815-3/4-CG-FVertical feed, .001” gold wire tool for access into cavities. Works well on West bond deep access machines.
.0007” deep access wedge tool 4560-1507-3/4 FVertical feed .0007” gold wire tool for access into cavities. Works well on deep access Westbond machines. Our favorite for bonding FETs.
.001-125" Auto Wedge Tool2160-2025-1.078-CBRVersatile wedge tool for .001"-.00125" Al wire, autobonding applications
Waffle Tacking tool 2T00-DWG00130Used for tacking beam leads, coils and ribbon. Waffle design gives great bond pull results
Cut Tungsten Wire.0009 Tungsten3" x .0009" cut tungsten wire used to unplug bonding capillaries and wedges. 100 piece set
Bonding Probe1024 Unplugging Probe3/4" x .010" probe that tapers to .0006" tip. Utility probe used to unplug capillaries and wedges, epoxy dispense needles, and dress wires. 25 piece set
Bonding ShimsGold over nickel plated Moly Square.020" x .020" x .005", 50 micro inches Au min. over 50 micro inches Ni min plate Moly. Bonding shim used for creating/repairing bonding areas on substrates. Attach with solder or epoxy. 250 pcs in vial.