| Description | Bonding Source P/N | Application |
| .001” gold ball bond capillary | 1572-15-625GM20D | General purpose ball bond tool for .001” gold wire. .625” tool length will allow for access into most microwave housings. |
| .0008” gold ball bond capillary | 1572-13S-625GM20D | General purpose ball bond tool for .0008” gold wire. .625” tool length will allow for access into most microwave housings. |
| Bottleneck Ball bond capillary |
1851-13-625GM-38(1.75-11D-5) 20DAB101X10-CDR2B | .0008-.001” ball bond capillarydesigned for hard to reach areas and tight pad pitch |
| .001” wedge tool | 4445-2025-L-F-V | General purpose wedge tool for .001” gold and aluminum wire. Works well on Westbond machines. |
| .0007” wedge tool | 4445-1515-L-F-V | General purpose wedge tool for .0007” gold wire. Works well on Westbonds. |
| .001” deep access wedge tool |
4560-1815-3/4-CG-F | Vertical feed, .001” gold wire tool for access into cavities. Works well on West bond deep access machines. |
| .0007” deep access wedge tool |
4560-1507-3/4 F | Vertical feed .0007” gold wire tool for access into cavities. Works well on deep access Westbond machines. Our favorite for bonding FETs. |
| .001-125" Auto Wedge Tool | 2160-2025-1.078-CBR | Versatile wedge tool for .001"-.00125" Al wire, autobonding applications |
| Waffle Tacking tool |
2T00-DWG00130 | Used for tacking beam leads, coils and ribbon. Waffle design gives great bond pull results |
| Cut Tungsten Wire | .0009 Tungsten | 3" x .0009" cut tungsten wire used to unplug bonding capillaries and wedges. 100 piece set |
| Bonding Probe | 1024 Unplugging Probe | 3/4" x .010" probe that tapers to .0006" tip. Utility probe used to unplug capillaries and wedges, epoxy dispense needles, and dress wires. 25 piece set |
| Bonding Shims | Gold over nickel plated Moly Square | .020" x .020" x .005", 50 micro inches Au min. over 50 micro inches Ni min plate Moly. Bonding shim used for creating/repairing bonding areas on substrates. Attach with solder or epoxy. 250 pcs in vial. |