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| Electrically
Conductive Adhesive Pastes |
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| Product Number |
Manufacturer |
Certified to MIL-STD 883, Method 5011 |
Features |
Syringe Size |
Work Life @ Room Temp |
Storage Life |
Recommended Cure Schedule |
| 84-1LMI |
Ablestik |
Yes |
die attach, auto & hand dispense, screen print |
3 cc |
2 weeks |
1 yr., -40c |
60 min @ 150˚C |
| 84-1LMIT |
Ablestik |
Yes |
die attach, higher thermal |
3 cc |
2 weeks |
1 yr., -40c |
60 min @ 150˚C |
| 84-1LMIT1 |
Ablestik |
Yes |
die attach, higher thermal, lower viscosity |
1 cc |
2 weeks |
1 yr., -40c |
60 min @ 150˚C |
| 84-1LMINB |
Ablestik |
Yes |
die attach, high purity, no-bleed |
1 cc |
3 days |
1 yr., -40c |
30 min @ 150˚C |
| 2600AT |
Ablestik |
No |
High Heat Extraction, Die attach |
3 cc |
24 hours |
1 yr, -40c |
Ramp Cure |
| XCE - 3104 XL |
Emerson & Cuming |
No |
component attach, solder replacement, lead free |
3 cc |
18 hours |
6 mo., -40c |
10 min @ 150˚C |
| 8175 |
Ablestik |
Yes |
die attach, stress absorbing, fine pitch printing |
3 cc |
2 weeks |
1 yr., -40c |
30 min @ 130˚C |
| H2OE |
Epoxy Technology |
No |
die attach, good thermal, 1 part frozen |
3 cc |
|
1 yr., -40c |
10 min @ 150˚C |
| H2OE |
Epoxy Technology |
No |
die attach, good thermal, economical, 2 part |
1 oz kit |
2.5 days |
1 yr., 25c |
10 min @ 150˚C |
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| Electrically
Insulating Adhesive Pastes |
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| Product Number |
Manufacturer |
Certified to MIL-STD 883, Method 5011 |
Features |
Syringe Size |
Work Life @ Room Temp |
Storage Life |
Recommended Cure Schedule |
| 84-3 |
Ablestik |
Yes |
die attach, one component |
1 cc |
2 week |
1 yr., -40c |
60 min @ 150˚C |
| 958-11 |
Ablestik |
Yes |
die attach, stress absorbing, one component |
1 cc |
2 week |
1 yr., -40c |
60 min @ 150˚C |
| H70E |
Epoxy Technology |
No |
die attach and staking, economical |
1 lb kit |
2 days |
1 yr., 25c |
30 min @ 150˚C |
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| Electrically
Conductive Adhesive Films |
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| Product Number |
Manufacturer |
Certified to MIL-STD 883, Method 5011 |
Features |
Film Thickness (Mils) |
Work Life @ Room Temp |
Storage Life |
Recommended Cure Schedule |
| 5025E |
Ablestik |
Yes |
10" x 12" sheet, high electrical & thermal
performance |
2,3,4 |
3 months |
1 yr, -40C |
30 min @ 150˚C |
| CF - 3350 |
Emerson & Cuming |
No |
10" x 12" sheet, high electrical & thermal
performance |
2,4 |
3 months |
9 mo. @ 5c 1 yr, -40C |
30 min @ 150˚C |
| ECF561E |
Ablestik |
No |
12" x 12" sheet, for CTE mismatch |
5 |
4 days |
1 yr., -40c |
30 min @ 150˚C |
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| Thermally Conductive
Adhesive Films |
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| Product Number |
Manufacturer |
Certified to MIL-STD 883, Method 5011 |
Features |
Film Thickness (Mils) |
Work Life @ Room Temp |
Storage Life |
Recommended Cure Schedule |
| 5020K |
Ablestik |
Yes |
10" x 12" sheet, thermally conductive, glass
supported |
5 |
6 months |
1 yr., -40c |
60 min @ 150˚C |
| 550K |
Ablestik |
No |
12" x 12" sheet, thermally conductive, glass
supported |
5 |
6 months |
1 yr., -40c |
30 min @ 150˚C |
| 570K |
Ablestik |
Yes |
8" x 12" sheet, high thermal, heat sink |
5 |
2 weeks |
1 yr., -40c |
3 hrs. @ 150˚C |
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| Encapsulants and
Glob Top |
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| Product Number |
Manufacturer |
Certified to MIL-STD 883, Method 5011 |
Features |
Syringe Size |
Work Life @ Room Temp |
Storage Life |
Recommended Cure Schedule |
| FP4401 |
Loctite/Hysol |
No |
low flow, high purity glob top |
10 cc |
24 hours |
1 yr., -40c |
6 hours @ 150˚C |
| FP4451 |
Loctite/Hysol |
No |
high purity damming material |
10 cc |
2 days |
1 yr., -40c |
1 hour @ 165˚C |
| FP4650 |
Loctite/Hysol |
No |
high purity liquid epoxy encapsulant |
30 cc |
8 days |
1 yr., -40c |
3 hours @ 170˚C |
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